Aluminum Nitride Ceramic Wafer

Technical Specifications:

• Standard diameters: 50mm, 75mm, 100mm, 150mm

• Thickness range: 0.25mm to 3.0mm

• Surface finish: As-fired (Ra <0.5μm) or double-side polished (Ra <0.1μm)

• Metallization options: Au, Ag, Cu, or Ni/Au plating

Key Features:
✔ CTE matched to silicon (ideal for semiconductor applications)
✔ Low dielectric loss (tan δ <0.0005 @ 1MHz)
✔ Available with through-holes or blind vias

Applications:

• Power electronics substrates (IGBT, LED)

• RF/microwave circuit carriers

• MEMS device packaging