Zirconia Ceramic Machined Parts

Precision Capabilities:

• CNC grinding: ±0.002mm tolerance

• Laser drilling: 0.05-0.5mm holes

• Ultrasonic machining: Complex 3D contours

Post-Processing Options:
✓ HIP treatment for zero porosity
✓ Mirror polishing (Ra <0.01μm)
✓ Laser marking/engraving

Typical Components:

• Microfluidic device chips

• Optical lens mounts

• Semiconductor wafer chucks